Institute of plasma physics › Structure of IPP › Plasma Chemistry and Materials Division › Materials Engineering Department › Key Technologies
Key Technologies
For the development of novel materials on both laboratory and application scales, we employ four key manufacturing technologies:
- Plasma spraying using the WSP-H torch
- Plasma spraying using the RF-ICP torch
- Cold spray
- SPS/UHS powder sintering
Plasma Spraying with WSP-H Torch
The hybrid water/argon-stabilized plasma torch WSP-H, developed at our institute, enables operation at extremely high temperatures of up to 25,000 °C. In this world‑unique system, plasma is generated by an electric arc using a gas (argon) and water vapor, combining the advantages of gas and water stabilization. While the gas contributes to the extended cathode life, the water vapor increases plasma enthalpy and allows deposition rates of up to tens of kilograms per hour, from both powders and liquids (suspensions and solutions). The WSP-H torch is characterized by very low operating costs and is well suited for spraying on large-scale parts, production of thick or free-standing coatings, and plasma treatment of materials (e.g., powder spheroidization). Materials commonly deposited in our lab include various oxides (alumina, chromia, zirconia, titania) and natural minerals (silicates, garnets), as well as tungsten and its alloys. We operate the WSP-H 500 system, developed in collaboration with Czech company ProjectSoft HK a.s. This system is commercially available and supplied to customers worldwide. For more information, visit www.wsp-h.com.
Plasma Spraying with RF-ICP Torch
The radiofrequency inductively coupled plasma (RF-ICP) torch allows electrode-free generation of thermal plasma using an RF source. The plasma is created in an enclosed chamber, enabling deposition in a protective atmosphere without oxidation. This makes the system ideal for deposition of highly pure metallic materials. We operate the TekSpray-15 system from the Canadian company Tekna, which may be also fitted with the TekSphero-15 spheroidization reactor. This setup is used for powder homogenization and spheroidization, e.g., for additive manufacturing applications.
Cold Spray (CS)
Cold spray is a highly effective deposition method for ductile pure metals and metal alloys. Unlike high-temperature thermal spray techniques, CS does not melt the feedstock powder; instead, coatings and deposits are formed via kinetic energy alone. This mitigates issues such as oxidation, phase changes, or selective evaporation, resulting in excellent microstructure and properties of the deposits. The cold sprayed materials are highly homogeneous, dense, and exhibit outstanding adhesion, cohesion, strength, and hardness. The method also allows for exceptionally high deposition rates (up to 80 kg/h) with minimal material loss, and the resulting coatings are easily machinable. Because of these advantages, we also use CS for repair of damaged parts and as a direct additive manufacturing method (i.e., 3D printing) called Cold Spray Additive Manufacturing (CSAM). Compared to traditional laser-based AM methods involving melting, CS offers many benefits: production of components with virtually no size limitations, no need for protective atmospheres, no toxic by-products, and no issues with reflective metals. In addition, it allows co-deposition of metal mixtures with highly differing melting points and introduces very low heat input and minimal heat-affected zones. We operate the modular Kinetics 8000-X system from the German company CGT. For more information, visit www.coldsprayprague.com.
Powder Sintering via SPS
Spark Plasma Sintering (SPS), also known as Field-Assisted Sintering Technique (FAST) or Pulsed Electric Current Sintering (PECS), enables ultra-fast consolidation of both metallic and non-metallic materials.
The process involves pressing powder in a die while heating it resistively via electric current. Extremely high heating rates and short sintering times allow the production of crystalline or amorphous materials from high-melting-point powders, and enable fabrication of nanomaterials with minimal grain growth. Sintering is performed under vacuum or protective gas, ensuring high chemical purity. By combining different powder types, composite materials with tailored microstructures can be easily fabricated. We operate the SPS 10-4 unit from Thermal Technology LLC (USA), which we have modified also for use in flash sintering and UHS (Ultrafast High-Temperature Sintering) setup.
The process involves pressing powder in a die while heating it resistively via electric current. Extremely high heating rates and short sintering times allow the production of crystalline or amorphous materials from high-melting-point powders, and enable fabrication of nanomaterials with minimal grain growth. Sintering is performed under vacuum or protective gas, ensuring high chemical purity. By combining different powder types, composite materials with tailored microstructures can be easily fabricated. We operate the SPS 10-4 unit from Thermal Technology LLC (USA), which we have modified also for use in flash sintering and UHS (Ultrafast High-Temperature Sintering) setup.
